Trade Lam Research Corporation - LRCX CFD

Trading Conditions

• Spread: 0.86
• Long position overnight feeLong position overnight feeMargin. Your investmentUS$1,000.00Overnight feeCharges from full value of position-0.026179 %(-US$1.05)Trade size with leverage ~ US$5,000.00Short position overnight fee ~ US$4,000.00Go to platform: -0.026179%
• Short position overnight feeShort position overnight feeMargin. Your investmentUS$1,000.00Overnight feeCharges from full value of position0.003957 %(US$0.16)Trade size with leverage ~ US$5,000.00Short position overnight fee ~ US$4,000.00Go to platform: 0.003957%
• Overnight fee time: 21:00 (UTC)
• Currency: USD
• Min traded quantity: 1
• Margin: 20
• Stock exchange: United States of America
• Commission on trade: 0%

• Margin. Your investment: US$1,000.00
• Overnight feeCharges from full value of position: -0.026179 %
  (-US$1.05)

• Margin. Your investment: US$1,000.00
• Overnight feeCharges from full value of position: 0.003957 %
  (US$0.16)

Key Stats

• Prev. Close: 900.66
• Open: 904.47
• 1-Year Change: 80.92%
• Day's Range: 904.47 - 928.92

Lam Research Company profile

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits worldwide. The company offers thin film deposition products, including SABRE electrochemical deposition products for copper damascene manufacturing; ALTUS systems to deposit conformal atomic layer films for tungsten metallization applications; VECTOR plasma-enhanced chemical vapor deposition (CVD) and atomic layer deposition systems to deposit oxides, nitrides, and carbides for hardmasks, multiple patterning films, anti-reflective layers, multi-layer stack films, and diffusion barriers; and Striker atomic layer deposition systems that deliver conformal dielectric films for spacer-based patterning and liner applications in various advanced memory and logic structures. Its thin film deposition products also comprise SPEED high-density plasma CVD products for applications in shallow trench isolation, pre-metal dielectrics, inter-layer dielectrics, inter-metal dielectrics, and passivation layers; and SOLA ultraviolet thermal processing products for treatment of back-end-of-line (BEOL) low-k dielectric films and front-end-of-line silicon nitride strained films. In addition, the company offers plasma etch products, such as Kiyo that provide solutions for conductor etch applications; Versys metal products, which offer a platform for BEOL metal etch processes; Flex for dielectric etch applications; and Syndion to address various through-silicon via etch and complementary image sensor etch applications. Further, it provides single-wafer clean products comprising EOS, Da Vinci, DV-Prime, and SP series products for wet etch and clean applications in wafer-level packaging; and Coronus plasma-based bevel clean products to enhance die yield by removing particles, residues, and unwanted films from the wafer's edge, as well as legacy products. The company was founded in 1980 and is headquartered in Fremont, California.