UPM presenta a PACK EXPO imballaggi in carta con barriere a base di amido
- UPM parteciperà al PACK EXPO di Chicago dal 18 al 21 ottobre, presentando campioni di imballaggi cartacei sviluppati con Ingredion e Paramelt.
- La soluzione a base di UPM Solide Lucent ha superato la prima fase dei test di riciclabilità presso la Western Michigan University.
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