Lam Research Sees Glass Substrates Gaining Momentum in Advanced Chip Packaging

By Public Technologies
  • Glass substrates are gaining momentum in advanced chip packaging, supporting larger, denser AI and high-performance computing packages.
  • Widespread adoption faces manufacturing and standardization hurdles, with supplier differences in panel sizes, via specifications and material stacks complicating integration.
  • Temporary glass carriers are established in production, while permanent glass interposers and glass-core substrates remain at earlier development and adoption stages.
  • Lam Research is investing in process research and panel-processing equipment to help customers scale glass-based packaging.


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