Trade Amkor Technology, Inc. - AMKR CFD

Amkor Technology, Inc. Company profile

About Amkor Technology, Inc.

Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. It refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include leadframe packages, substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages.

Financial summary

BRIEF: For the fiscal year ended 31 December 2021, Amkor Technology, Inc. revenues increased 22% to $6.14B. Net income increased 90% to $643M. Revenues reflect Advanced products segment increase of 38% to $4.41B, United States segment increase of 19% to $2.82B, Asia Pacific -(Excluding Japan) segment increase of 49% to $999.6M. Net income benefited from Interest expense - Balancing value decrease of 23% to $48.7M (expense), Foreign currency (gain) loss.

Equity composition

Common Stock $.001 Par, 03/11, 500M auth., 197,178,000 issd., less 117,000 shs. in Treas. @$862K. Insiders & strategic holders own 62.15%. IPO 5/98,30,000,000 shares @ $11 by SalomonSmith Barney.

2045 East Innovation Circle
TEMPE
ARIZONA 85284
US