ASM Pacific Technology Limited, an investment holding company, engages in the design, manufacture, and marketing of machines, tools, and materials used in the semiconductor and electronics assembly industries worldwide. It operates through three segments: Back-end Equipment, Surface Mount Technology Solutions, and Materials. The Back-end Equipment segment manufactures and markets a line of assembly and packaging equipment for the microelectronics, semiconductor, photonics, and optoelectronics industries. This segment's products include automatic optical inspection/FOL equipment, die attach equipment, CMOS imaging sensor equipment, dispensing equipment, factory automation equipment, encapsulation solutions equipment, automatic trim and form systems, test and finish handling systems, wafer separation systems, and wire bonding equipment, as well as LED testing, sorting, and taping systems. The Surface Mount Technology Solutions segment develops and sells DEK printers for the surface mount technology (SMT), semiconductor, and solar markets, as well as SIPLACE SMT placement solutions. The Materials segment engages in the production and sale of semiconductor packaging materials. It offers etched and stamped leadframes used by multinational chip manufacturers, independent integrated circuit assembly houses, and consumer electronics manufacturers; molded interconnect substrates; and IC and small signal discrete products. The company also trades in surface mount technology equipment, and semiconductor equipment and materials; and provides marketing services. The company was founded in 1975 and is based in Tsing Yi, Hong Kong.