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BE Semiconductor Industries Company profile

About BE Semiconductor Industries NV

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Financial summary

BRIEF: For the fiscal year ended 31 December 2021, BE Semiconductor Industries NV revenues increased 73% to EUR749.3M. Net income increased from EUR132.3M to EUR282.4M. Revenues reflect Die Attach segment increase of 78% to EUR617.7M, Packaging segment increase of 56% to EUR114.4M. Net income benefited from Capitalization of R&D charges increase of 31% to EUR23M (income), Amortization of intangibles decrease of 19% to EUR7.4M (expense).

Equity composition

7/2016, Nominal value changed 5/2018, 2-for-1 stock split (Factor: 2).