Trade BE Semiconductor Industries N.V. - BESI CFD

Trading Conditions

• TypeThis financial market is available for CFD trading.Learn more about:CFDs: CFD
• Spread: 0.58
• Long position overnight funding adjustmentLong position overnight funding adjustmentMargin. Your investment€1,000.00Overnight funding adjustmentCharges from full value of position-0.017304 %(-€3.46)Trade size with leverage ~ €20,000.00Money from leverage ~ $€19,000.00Go to platform: -0.01730%
• Short position overnight funding adjustmentShort position overnight funding adjustmentMargin. Your investment€1,000.00Overnight funding adjustmentCharges from full value of position-0.004918 %(-€0.98)Trade size with leverage ~ €20,000.00Money from leverage ~ $€19,000.00Go to platform: -0.00492%
• Overnight funding adjustment time: 21:00 (UTC)
• Currency: EUR
• Min traded quantity: 0.1
• Margin: 5.00%
• Stock exchange: Netherlands
• Commission on trade: 0%
• Guaranteed stop premiumA guaranteed stop-loss (GSL) fee is only charged if the GSL is triggered. Please consult the Charges and Fees section of our website for more details.: 1%

• Margin. Your investment: €1,000.00
• Overnight funding adjustmentCharges from full value of position: -0.017304 %
  (-€3.46)

• Margin. Your investment: €1,000.00
• Overnight funding adjustmentCharges from full value of position: -0.004918 %
  (-€0.98)

Key Stats

• Prev. Close: 243.655
• Open: 246.05
• 1-Year Change: 94.94%
• Day's Range: 231.965 - 246.05

Trade BE Semiconductor Industries N.V. - BESI

About BE Semiconductor Industries NV

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

Financial summary

BRIEF: For the fiscal year ended 31 December 2021, BE Semiconductor Industries NV revenues increased 73% to EUR749.3M. Net income increased from EUR132.3M to EUR282.4M. Revenues reflect Die Attach segment increase of 78% to EUR617.7M, Packaging segment increase of 56% to EUR114.4M. Net income benefited from Capitalization of R&D charges increase of 31% to EUR23M (income), Amortization of intangibles decrease of 19% to EUR7.4M (expense).

Equity composition

7/2016, Nominal value changed 5/2018, 2-for-1 stock split (Factor: 2).