Taiwan's UMC launches $1.8 billion convertible bond sale, term sheet shows
By Yantoultra Ngui
HONG KONG, Oct 5 (Reuters) - Taiwan chipmaker United Microelectronics Corp 2303.TW, or UMC, plans to raise $1.8 billion through two zero-coupon convertible bond sales, with proceeds earmarked for equipment purchases and plant construction, according to a term sheet on Monday.
Here are details from the term sheet:
UMC will offer $900 million of bonds due in April 2028 and $900 million due in October 2031. The bonds pay no interest but can be converted into UMC shares
The 2028 bonds would convert at T$179.19 to T$186.81 per share, representing a premium of 17.5% to 22.5% over UMC's closing share price of T$152.50
The 2031 bonds would convert at T$202.06 ($6.36) to T$209.69 per share, representing a 32.5% to 37.5% premium
The dollar-denominated bonds will be linked to the Taiwan dollar but settled in US dollars
The 2028 bonds carry an implied negative annual yield of 1.25% to 1.75%, while the 2031 bonds carry a negative annual yield of 0.25% to 0.75%
Investors will have the option to require UMC to repurchase the 2031 bonds in 2027 or 2029
Proceeds will be used for machinery and equipment purchases and plant construction
The bonds are expected to price on Monday and settle later in the week
Morgan Stanley MS.N and Citigroup C.N are joint global coordinators and bookrunners, while HSBC HSBA.L is also a bookrunner
UMC did not immediately respond to a Reuters request for comment
($1 = 31.7750 Taiwan dollars)