Change in Aspocomp's Management Team – Ville Raatikainen has been appointed Aspocomp's Chief Engineering and Technology Officer

By Inderes

Aspocomp Group Plc, Stock Exchange Release, September 24, 2026, at 1:00 p.m. EEST

Change in Aspocomp's Management Team – Ville Raatikainen has been appointed Aspocomp's Chief Engineering and Technology Officer

Aspocomp has appointed Ville Raatikainen, (born 1984), M.Sc. (Eng.), as the company's Chief Engineering and Technology Officer and a member of the Management Team, effective January 1, 2027. He has over 15 years of diverse experience in technology and industrial companies, where he has led product development, manufacturing, and product lifecycles. Most recently, he has served as Director, Product Lifecycle and Manufacturing Engineering at iLOQ Oy. Prior to this, he worked in various R&D and product management roles at Nokia.

President and CEO Manu Skyttä: “Ville has a strong track record in managing complex technical environments, improving production performance, and developing high-quality, cost-effective design operations. He has a strong background in both global listed companies like Nokia and fast-growing technology companies like iLOQ, and I am pleased to welcome him to Aspocomp."

Following the change, the company's current Chief Technology Officer and Management Team member Mitri Mattila will continue to serve the company, reporting to Ville Raatikainen starting January 1, 2027.

Management Team composition, effective January 1, 2027:

Manu Skyttä, President and CEO;Antti Ojala, CCO and Deputy CEO;Pekka Holopainen, COO;Hanna-Leena Keskitalo, HR Director;Terhi Launis, CFO; Ilkka Lohi, Quality Director; andVille Raatikainen, Chief Engineering and Technology Officer.





The members of the Management Team report to President and CEO Manu Skyttä.

For further information, please contact: Manu Skyttä, President and CEO, phone +358 20 775 6860, manu.skytta(at)aspocomp.com.ASPOCOMP GROUP PLC



Aspocomp – heart of your technology

A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.

Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.

Aspocomp is headquartered in Espoo, and its plant is in Oulu, one of Finland’s major technology hubs.

www.aspocomp.com

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