Applied Materials, Besi expand strategic partnership on next-generation advanced packaging for AI chips

By Public Technologies
  • Applied Materials expanded its strategic partnership with Besi to develop next-generation advanced packaging technology for AI-driven chip scaling.
  • Besi joined Applied’s EPIC Center as an innovation partner, broadening joint R&D beyond die-to-wafer hybrid bonding.
  • Work targets 3D IC scaling, tighter logic-memory integration, photonics interconnects, thermocompression bonding scaling, new die-on-wafer and panel architectures.
  • Collaboration builds on a 2020 Singapore program that produced Kinex, an integrated die-to-wafer hybrid bonding system.
  • Applied’s EPIC Center investment was pegged at USD 5 billion, intended to speed commercialization from research to high-volume manufacturing.


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