Qualcomm issues $4 billion in senior unsecured debt
- Qualcomm entered an underwriting agreement on November 9, 2026, for a $4 billion senior unsecured notes offering.
- The offering includes $750 million of 5% notes due November 20, 2028, and $750 million of 5.15% notes due November 20, 2029.
- A $1 billion tranche carries a 5.35% coupon and matures November 20, 2031.
- Two $750 million tranches carry coupons of 5.6% and 5.8%, maturing November 20, 2033, and November 20, 2036, respectively.
- Interest is payable semiannually on May 20 and November 20, beginning May 20, 2027.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Qualcomm Inc. published the original content used to generate this news brief via EDGAR, the Electronic Data Gathering, Analysis, and Retrieval system operated by the U.S. Securities and Exchange Commission (Ref. ID: 0001104659-26-127163), on November 13, 2026, and is solely responsible for the information contained therein.