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Samsung backs Korea’s push for eight AI chips by 2030

By Maekyung News Service

The South Korean government plans to develop eight homegrown artificial intelligence (AI) chips by 2030 for use in autonomous vehicles, home appliances, and robots, with Samsung Electronics Co. supporting prototype production using its advanced 2-nanometer-class manufacturing process.

The Ministry of Trade, Industry and Resources unveiled the roadmap at the second-half 2026 general meeting of the AI Semiconductor M.AX Alliance in Seoul on Thursday.

The project is part of an 800.2 billion won ($600 million) initiative launched in June to develop domestic AI semiconductors. It aims to bring together end-user companies in industries such as automotive, home appliances, robotics, and defense with local fabless chipmakers and software companies to develop AI semiconductors that can be integrated into commercial products.

Under the finalized roadmap, the government plans to develop 10 technologies by 2030, comprising eight AI chips and two semiconductor intellectual properties (IPs).

The eight chips will include one for autonomous vehicles, three for smart home appliances, and one each for collaborative robots, humanoid robots, agricultural robots, and unmanned drones.

The project will also develop two semiconductor IPs for advanced manufacturing processes and extreme operating environments.

The production schedule for one home appliance AI chip will be brought forward by more than a year from the original plan.

To support the project, the government will strengthen cooperation among end-user companies, foundries, and semiconductor IP providers. End-user companies will participate from the early stages of chip development and specify the performance requirements and technical specifications they need.

Samsung Electronics’ foundry division plans to prioritize domestic AI chip prototypes for production using advanced processes, including its 2-nanometer-class technology. It will assess demand for 21 prototype production runs next year in advance and coordinate with existing manufacturing schedules to give the projects priority in process allocation.

Domestic and international semiconductor IP companies will also ease the design cost burden on fabless companies by offering more flexible payment terms for IP and providing shared IP packages that can be used by multiple companies.

A joint public-private strategic committee will be established to monitor the project’s progress. The committee, co-chaired by the vice minister of trade and industry and Kyung Hee University President Kim Jin-sang, will review and finalize annual development plans early each year.

At Thursday’s meeting, Samsung Electronics’ foundry division, Cadence Korea and Openedges Technology Inc. presented their cooperation plans. Development roadmaps were also unveiled for seven sectors: automotive, home appliances, collaborative and humanoid robots, unmanned agricultural machinery, defense, and commercialization and broader market adoption.

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